Hot-Spot Engineering in Polygonal Nanofinger Assemblies for Surface Enhanced Raman Spectroscopy-Reference-Cited by-同舟云学术

Hot-Spot Engineering in Polygonal Nanofinger Assemblies for Surface Enhanced Raman Spectroscopy

Published:2011-05-23 Issue:6 Volume:11 Page:2538-2542
ISSN:1530-6984
Container-title:Nano Letters
language:en
Short-container-title:Nano Lett.

Author:

Ou Fung Suong¹,Hu Min¹,Naumov Ivan¹,Kim Ansoon¹,Wu Wei¹,Bratkovsky Alexander M.¹,Li Xuema¹,Williams R. Stanley¹,Li Zhiyong¹

Affiliation:

1. Intelligent Infrastructure Lab and ‡NanoElectronics Research Group, Hewlett-Packard Laboratories, 1501 Page Mill Road, Palo Alto, California 94304, United States

Publisher

American Chemical Society (ACS)

Subject

Mechanical Engineering,Condensed Matter Physics,General Materials Science,General Chemistry,Bioengineering

Link

https://pubs.acs.org/doi/pdf/10.1021/nl201212n

Reference30 articles.

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