Method to Reduce the Contact Resistivity between Galinstan and a Copper Electrode for Electrical Connection in Flexible Devices-Reference-Cited by-同舟云学术

Method to Reduce the Contact Resistivity between Galinstan and a Copper Electrode for Electrical Connection in Flexible Devices

Author:

Sato Takashi¹^ORCID,Yamagishi Kento²,Hashimoto Michinao²³^ORCID,Iwase Eiji¹⁴^ORCID

Affiliation:

1. Department of Material Science, Waseda University, 3-4-1 Okubo, Shinjuku-ku, Tokyo 169-8555, Japan

2. Digital Manufacturing and Design Centre, Singapore University of Technology and Design, 8 Somapah Road, Singapore 487372

3. Pillar of Engineering Product Development, Singapore University of Technology and Design, 8 Somapah Road, Singapore 487372

4. Department of Applied Mechanics and Aerospace Engineering, Waseda University, 3-4-1 Okubo, Shinjuku-ku, Tokyo 169-8555, Japan

Funder

Core Research for Evolutional Science and Technology

Digital Manufacturing and Design Center, Singapore University of Technology and Design

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

Reference56 articles.

Cited by 13 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electronic Component Mounting with Liquid Metal for Highly Stretchable Electronic Devices;2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS);2024-01-21