Dielectric Polymers Tolerant to Electric Field and Temperature Extremes: Integration of Phenomenology, Informatics, and Experimental Validation-Reference-Cited by-同舟云学术

Dielectric Polymers Tolerant to Electric Field and Temperature Extremes: Integration of Phenomenology, Informatics, and Experimental Validation

Published:2021-08-26 Issue:45 Volume:13 Page:53416-53424
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Wu Chao¹^ORCID,Chen Lihua²^ORCID,Deshmukh Ajinkya³,Kamal Deepak²^ORCID,Li Zongze¹,Shetty Pranav⁴^ORCID,Zhou Jierui¹,Sahu Harikrishna²^ORCID,Tran Huan²^ORCID,Sotzing Gregory³,Ramprasad Rampi²^ORCID,Cao Yang¹^ORCID

Affiliation:

1. Electrical Insulation Research Center, University of Connecticut, 97 North Eagleville Road, Storrs, Connecticut 06269, United States

2. School of Materials Science and Engineering, Georgia Institute of Technology, 771 Ferst Drive NW, Atlanta, Georgia 30332, United States

3. Institute of Materials Science, University of Connecticut, 97 North Eagleville Road, Storrs, Connecticut 06269, United States

4. School of Computational Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States

Funder

Office of Naval Research

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.1c11885

Reference39 articles.

1. The Role of Interfaces in Polyethylene/Metal-Oxide Nanocomposites for Ultrahigh-Voltage Insulating Materials

2. Ferroelectric polymer networks with high energy density and improved discharged efficiency for dielectric energy storage

3. Flexible Temperature‐Invariant Polymer Dielectrics with Large Bandgap

4. Flexible high-temperature dielectric materials from polymer nanocomposites

5. High‐Performance Polymers Sandwiched with Chemical Vapor Deposited Hexagonal Boron Nitrides as Scalable High‐Temperature Dielectric Materials

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