Strong Negative Thermal Expansion in a Low-Cost and Facile Oxide of Cu2P2O7

Author:

Shi Naike1,Sanson Andrea2ORCID,Gao Qilong3,Sun Qiang3,Ren Yang4ORCID,Huang Qingzhen5,de Souza Danilo Oliveira6,Xing Xianran7ORCID,Chen Jun1ORCID

Affiliation:

1. Beijing Advanced Innovation Center for Materials Genome Engineering and School of Mathematics and Physics, University of Science and Technology Beijing, Beijing 100083, China

2. Department of Physics and Astronomy, University of Padova, Padova I-35131, Italy

3. School of Physics and Engineering, Zhengzhou University, Zhengzhou 450001, China

4. X-ray Science Division, Argonne National Laboratory, Argonne, Illinois 60439, United States

5. NIST Center for Neutron Research, National Institute of Standards and Technology, Gaithersburg, Maryland 20899-6102, United States

6. Elettra Sincrotrone Trieste, 34149 Basovizza, Italy

7. Beijing Advanced Innovation Center for Materials Genome Engineering and Institute of Solid State Chemistry, University of Science and Technology Beijing, Beijing 100083, China

Funder

State Administration of Foreign Experts Affairs

Ministry of Education of the People's Republic of China

National Natural Science Foundation of China

Publisher

American Chemical Society (ACS)

Subject

Colloid and Surface Chemistry,Biochemistry,General Chemistry,Catalysis

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