Magnetic Alignment of Hexagonal Boron Nitride Platelets in Polymer Matrix: Toward High Performance Anisotropic Polymer Composites for Electronic Encapsulation-Reference-Cited by-同舟云学术

Magnetic Alignment of Hexagonal Boron Nitride Platelets in Polymer Matrix: Toward High Performance Anisotropic Polymer Composites for Electronic Encapsulation

Published:2013-07-15 Issue:15 Volume:5 Page:7633-7640
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Lin Ziyin,Liu Yan,Raghavan Sathyanarayanan,Moon Kyoung-sik,Sitaraman Suresh K.,Wong Ching-ping¹

Affiliation:

1. Department of Electronic Engineering, The Chinese University of Hong Kong, Hong Kong

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/am401939z

Reference45 articles.

1. Thermal Challenges in Next-Generation Electronic Systems

2. Wong, C. P.; Moon, K. S.; Li, Y.Nano-Bio-Electronic, Photonic and MEMS Packaging;Springer:New York, 2010; p277–314.

3. Materials for Advanced Packaging

4. Thermal Interface Materials: Historical Perspective, Status, and Future Directions

5. Thermal conductivity, elastic modulus, and coefficient of thermal expansion of polymer composites filled with ceramic particles for electronic packaging

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