Solvent Effects on the Thioamide Rotational Barrier: An Experimental and Theoretical Study
Author:
Affiliation:
1. Contribution from the Department of Chemistry, Yale University, New Haven, Connecticut 06520-8107
Publisher
American Chemical Society (ACS)
Subject
Colloid and Surface Chemistry,Biochemistry,General Chemistry,Catalysis
Link
https://pubs.acs.org/doi/pdf/10.1021/ja003586y
Reference52 articles.
1. Amides. 3. Experimental and Theoretical Studies of the Effect of the Medium on the Rotational Barriers for N,N-Dimethylformamide and N,N-Dimethylacetamide
2. Gaussian‐2 theory using reduced Mo/ller–Plesset orders
3. Gas-phase carbon-13 NMR spectra and exchange kinetics of N,N-dimethylformamide
4. Why Does Thioformamide Have a Larger Rotational Barrier Than Formamide?
5. Gas-Phase NMR Studies of N,N-Dimethylthioamides. Influence of the Thiocarbonyl Substituent on the Internal Rotation Activation Energies
Cited by 122 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Variable temperature-nuclear magnetic resonance experiment and high-resolution MS/MSn measurement of hydroxycarbodenafil, and its PDE5 inhibitory activity;Journal of Pharmaceutical and Biomedical Analysis;2024-08
2. Variable Temperature-Nuclear Magnetic Resonance Experiment and High-Resolution Ms/Msn Measurement of Hydroxycarbodenafil, and its Pde5 Inhibitory Activity;2024
3. Contemporary Applications of Thioamides and Methods for their Synthesis;Chemistry – A European Journal;2023-12-21
4. A Small Change in Structure, a Big Change in Flexibility;Molecules;2023-12-08
5. Esterification of Thioamides via Selective N–C(S) Cleavage under Mild Conditions;Organic Letters;2023-08-14
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3