Evolution of Reactive Concentration during Borohydride-Reduced Electroless Nickel–Boron Plating and Design of a Replenishment Procedure
Author:
Affiliation:
1. Université de Mons, Service de Métallurgie, Place du Parc, 20, 7000 Mons, Belgique
2. Université de Mons, Service de Science des Matériaux, Place du Parc, 20, 7000 Mons, Belgique
Publisher
American Chemical Society (ACS)
Subject
Industrial and Manufacturing Engineering,General Chemical Engineering,General Chemistry
Link
https://pubs.acs.org/doi/pdf/10.1021/ie202687y
Reference16 articles.
1. Nickel plating on steel by chemical reduction
2. An overall aspect of electroless Ni-P depositions—A review article
3. Properties of electroless and electroplated Ni–P and its application in microgalvanics
4. The influence of SDS and CTAB surfactants on the surface morphology and surface topography of electroless Ni–P deposits
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