Facile production of ultra-fine silicon nanoparticles

Author:

Tokarska Klaudia1ORCID,Shi Qitao2ORCID,Otulakowski Lukasz1,Wrobel Pawel1ORCID,Ta Huy Quang3,Kurtyka Przemyslaw4ORCID,Kordyka Aleksandra1ORCID,Siwy Mariola1ORCID,Vasylieva Margaryta1,Forys Aleksander1ORCID,Trzebicka Barbara1ORCID,Bachmatiuk Alicja123ORCID,Rümmeli Mark H.1235ORCID

Affiliation:

1. Centre of Polymer and Carbon Materials, Polish Academy of Sciences (CMPW PAN), M. Curie-Sklodowskiej 34, Zabrze 41-819, Poland

2. Soochow Institute for Energy and Materials Innovations (SIEMIS), College of Energy, Key Laboratory of Advanced Carbon Materials and Wearable Energy Technologies of Jiangsu Province, Soochow University, Suzhou 215006, People's Republic of China

3. The Leibniz Institute for Solid State and Materials Research Dresden (IFW Dresden), Institute for Complex Materials, Helmholtzstrasse 20, 01069 Dresden, Germany

4. Department of Biomaterials and Medical Devices Engineering, Faculty of Biomedical Engineering, Silesian University of Technology, Roosevelta 40, Zabrze 41-800, Poland

5. Institute of Environmental Technology, VSB-Technical University of Ostrava, 17. Listopadu 15, Ostrava 708 33, Czech Republic

Abstract

A facile procedure for the synthesis of ultra-fine silicon nanoparticles without the need for a Schlenk vacuum line is presented. The process consists of the production of a (HSiO 1.5 ) n sol–gel precursor based on the polycondensation of low-cost trichlorosilane (HSiCl 3 ), followed by its annealing and etching. The obtained materials were thoroughly characterized after each preparation step by electron microscopy, Fourier transform and Raman spectroscopy, X-ray dispersion spectroscopy, diffraction methods and photoluminescence spectroscopy. The data confirm the formation of ultra-fine silicon nanoparticles with controllable average diameters between 1 and 5 nm depending on the etching time.

Publisher

The Royal Society

Subject

Multidisciplinary

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