How surface stress transforms surface profiles and adhesion of rough elastic bodies

Author:

Hui Chung-Yuen12ORCID,Liu Zezhou1ORCID,Bain Nicolas3,Jagota Anand4ORCID,Dufresne Eric R.3,Style Robert W.3,Kiyama Ryuji5,Gong Jian Ping267

Affiliation:

1. Field of Theoretical and Applied Mechanics, Sibley School of Mechanical and Aerospace Engineering, Cornell University, Ithaca, NY 14853, USA

2. Global Station for Soft Matter, GI-CoRE, Hokkaido University, Sapporo, Japan

3. Laboratory of Soft and Living Materials, Department of Materials, ETH Zürich, 8093 Zürich, Switzerland

4. Departments of Bioengineering and of Chemical and Biomolecular Engineering, Lehigh University, 111 Research Drive, Bethlehem, PA 18015, USA

5. Graduate School of Life Science, Hokkaido University, Sapporo 001-0021, Japan

6. Faculty of Advanced Life Science, Hokkaido University, Sapporo 001-0021, Japan

7. WPI-ICReDD, Hokkaido University, Sapporo 001-0021, Japan

Abstract

The surface of soft solids carries a surface stress that tends to flatten surface profiles. For example, surface features on a soft solid, fabricated by moulding against a stiff-patterned substrate, tend to flatten upon removal from the mould. In this work, we derive a transfer function in an explicit form that, given any initial surface profile, shows how to compute the shape of the corresponding flattened profile. We provide analytical results for several applications including flattening of one-dimensional and two-dimensional periodic structures, qualitative changes to the surface roughness spectrum, and how that strongly influences adhesion.

Funder

National Science Foundation

Japan Society for the Promotion of Science (JSPS) KAKENHI

Publisher

The Royal Society

Subject

General Physics and Astronomy,General Engineering,General Mathematics

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