Affiliation:
1. Department of Microelectronics, Delft University of Technology, Mekelweg 4, 2628 CD Delft, The Netherlands
Abstract
This paper describes the basics of single-photon counting in complementary metal oxide semiconductors, through single-photon avalanche diodes (SPADs), and the making of miniaturized pixels with photon-counting capability based on SPADs. Some applications, which may take advantage of SPAD image sensors, are outlined, such as fluorescence-based microscopy, three-dimensional time-of-flight imaging and biomedical imaging, to name just a few. The paper focuses on architectures that are best suited to those applications and the trade-offs they generate. In this context, architectures are described that efficiently collect the output of single pixels when designed in large arrays. Off-chip readout circuit requirements are described for a variety of applications in physics, medicine and the life sciences. Owing to the dynamic nature of SPADs, designs featuring a large number of SPADs require careful analysis of the target application for an optimal use of silicon real estate and of limited readout bandwidth. The paper also describes the main trade-offs involved in architecting such chips and the solutions adopted with focus on scalability and miniaturization.
Subject
General Physics and Astronomy,General Engineering,General Mathematics
Reference77 articles.
1. Charbon E. 2004 Will CMOS imagers ever need ultra-high speed?. In Proc. 7th Int. Conf. on Solid-State and Integrated Circuits Technology pp. 1975–1980. (doi:10.1109/ICSICT.2004.1435227).
2. Advanced Time-Correlated Single Photon Counting Techniques
3. Fast-fluorescence dynamics in nonratiometric calcium indicators
4. Niclass C Rochas A Besse PA& Charbon E. 2004 A CMOS single photon avalanche diode array for 3D imaging. IEEE Int. Solid-State Circuit Conf. (ISSCC) pp. 120–121. (doi:10.1109/ISSCC.2004.1332623).
5. Niclass C& Charbon E. 2005 A single photon detector array with 64 × 64 resolution and millimetric depth accuracy for 3D imaging. IEEE Int. Solid-State Circuit Conf. (ISSCC) pp. 364–365. (doi:10.1109/ISSCC.2005.1494020).
Cited by
99 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献