Molecular basis of conformational changes and mechanics of integrins

Author:

Gaikwad Hanmant K.1ORCID,Jaswandkar Sharad V.1ORCID,Katti Kalpana S.1ORCID,Haage Amanda2ORCID,Katti Dinesh R.1ORCID

Affiliation:

1. Department of Civil, Construction and Environmental Engineering, North Dakota State University, Fargo, ND 58105, USA

2. Department of Biomedical Sciences, University of North Dakota, Grand Forks, ND 58202, USA

Abstract

Integrin, as a mechanotransducer, establishes the mechanical reciprocity between the extracellular matrix (ECM) and cells at integrin-mediated adhesion sites. This study used steered molecular dynamics (SMD) simulations to investigate the mechanical responses of integrin α v β 3 with and without 10th type III fibronectin (FnIII 10 ) binding for tensile, bending and torsional loading conditions. The ligand-binding integrin confirmed the integrin activation during equilibration and altered the integrin dynamics by changing the interface interaction between β-tail, hybrid and epidermal growth factor domains during initial tensile loading. The tensile deformation in integrin molecules indicated that fibronectin ligand binding modulates its mechanical responses in the folded and unfolded conformation states. The bending deformation responses of extended integrin models reveal the change in behaviour of integrin molecules in the presence of Mn 2+ ion and ligand based on the application of force in the folding and unfolding directions of integrin. Furthermore, these SMD simulation results were used to predict the mechanical properties of integrin underlying the mechanism of integrin-based adhesion. The evaluation of integrin mechanics provides new insights into understanding the mechanotransmission (force transmission) between cells and ECM and contributes to developing an accurate model for integrin-mediated adhesion. This article is part of a discussion meeting issue ‘Supercomputing simulations of advanced materials’.

Funder

National Science Foundation

Publisher

The Royal Society

Subject

General Physics and Astronomy,General Engineering,General Mathematics

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