Advanced Lead-On-Chip Tape Design to Improve Thermal-Cycling Reliability in Semiconductor Devices
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Published:2015-01-01
Issue:1
Volume:7
Page:169-172
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ISSN:1947-2935
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Container-title:Science of Advanced Materials
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language:en
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Short-container-title:sci adv mater
Publisher
American Scientific Publishers
Subject
General Materials Science