Influence of an Annealing Temperature in a Vacuum Atmosphere on the Physical Properties of Indium Tin Oxide Nanorod Films

Author:

Charoenyuenyao Peerasil1,Promros Nathaporn1,Chaleawpong Rawiwan1,Noymaliwan Pitoon1,Borwornpornmetee Nattakorn1,Kamoldilok Surachart1,Porntheeraphat Supanit2,Saekow Bunpot2,Chaikeeree Tanapoj3,Samransuksamer Benjarong4,Nuchuay Peerapong3,Chananonnawathorn Chanunthorn3,Limwichean Saksorn3,Horprathum Mati3,Eiamchai Pitak3,Patthanasettakul Viyapol3

Affiliation:

1. Department of Physics, Faculty of Science, King Mongkut’s Institute of Technology Ladkrabang, Bangkok, 10520, Thailand

2. Photonics Technology Laboratory, National Electronics and Computer Technology Center (NECTEC), Pathumthani, 12120, Thailand

3. Optical Thin-Film Laboratory, National Electronics and Computer Technology Center (NECTEC), Pathumthani, 12120, Thailand

4. Department of Physics, Faculty of Science, King Mongkut’s University of Technology Thonburi, Bangkok, 10140, Thailand

Abstract

In the present study, indium tin oxide (ITO) nanorod films were produced by usage of ion-assisted electron-beam evaporation with a glancing angle deposition technique. The as-produced ITO nanorod films were annealed in the temperature range of 100–500 °C for two hours in a vacuum atmosphere. The as-produced ITO nanorod films exhibited (222) and (611) preferred orientations from the X-ray diffraction pattern. After vacuum annealing at 500 °C, the ITO nanorod films demonstrated many preferred orientations and the improvement of film crystallinity. The sheet resistance of the as-produced ITO nanorod films was 11.92 Ω/ and was found to be 13.63 Ω/ by annealing at 500 °C. The as-produced and annealed ITO nanorod films had a rod diameter of around 80 nm and transmittance in a visible zone of around 90%. The root mean square roughness of the as-produced ITO nanorod film’s surface was 5.49 nm, which increased to 13.77 nm at an annealing temperature of 500 °C. The contact angle of the as-produced ITO nanorod films was 110.9° and increased to 116.5° after annealing at 500 °C.

Publisher

American Scientific Publishers

Subject

Condensed Matter Physics,General Materials Science,Biomedical Engineering,General Chemistry,Bioengineering

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