Affiliation:
1. Department of Aerospace Engineering, Chosun University, Gwangju 61452, Republic of Korea
Abstract
In this paper, a mechanism of sensors for micro crack detection is proposed according to circuit disconnection. In order to detect micro cracks, sensitive sensors based on micropatterning using a electrohydrodynamic (EHD) technology are necessary. For EHD printing, it is essential to
find an optimum condition between ink materials and environmental parameters. Therefore, the distribution of the jetting mode between the flow rate and the voltage is confirmed through experiments. Metal-grid was patterned and resistance of each circuit by crack occurrence was measured. The
resistance changes are occurred at the position where the crack is generated, and the crack position can be estimated with grid type sensors. The resistance in the cracked circuits are relatively larger than it in non-cracked circuits. It was confirmed that micro cracks were well detected
by using the proposed crack sensors and mechanisms.
Publisher
American Scientific Publishers
Subject
Condensed Matter Physics,General Materials Science,Biomedical Engineering,General Chemistry,Bioengineering
Cited by
5 articles.
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