Study on the Corrosion Characteristics of Sputtered Barrier-Free Cu(MoN) Copper Seed Layers
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Published:2015-03-01
Issue:3
Volume:7
Page:257-261
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ISSN:1941-4900
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Container-title:Nanoscience and Nanotechnology Letters
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language:en
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Short-container-title:Nanosci Nanotechnol Lett
Author:
Wang Chun-Chieh,Huang Chia-Hung,Chu Chi-Wen,Liu Wei-Ren,Hwang Weng-Sing,Chiu Sung-Mao,Wei Chia-Min
Publisher
American Scientific Publishers
Subject
General Materials Science