Assessment of Spin-on-Glass for Fan-Out Wafer Level Packaging with Multilayer Interconnects
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Published:2018-09-01
Issue:9
Volume:10
Page:1187-1191
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ISSN:1941-4900
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Container-title:Nanoscience and Nanotechnology Letters
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language:en
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Short-container-title:nanosci nanotechnol lett
Author:
Song Changmin,Kim Sungdong,Kim Sarah Eunkyung
Publisher
American Scientific Publishers
Subject
General Materials Science