Diffusion of Co-Sputtered Metals as Bonding Materials for 3D Interconnects During Thermal Treatments
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Published:2012-03-01
Issue:3
Volume:12
Page:2467-2471
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ISSN:1533-4880
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Container-title:Journal of Nanoscience and Nanotechnology
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language:en
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Short-container-title:j nanosci nanotechnol
Author:
Hsu S. Y.,Chen H. Y.,Chen K. N.
Publisher
American Scientific Publishers
Subject
Condensed Matter Physics,General Materials Science,Biomedical Engineering,General Chemistry,Bioengineering