Effect of Temperature on Deformation and Fracture Behaviour of Nanostructured Polycrystalline Ni Under Tensile Hydrostatic Stress by Molecular Dynamics Simulation-Reference-Cited by-同舟云学术

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Effect of Temperature on Deformation and Fracture Behaviour of Nanostructured Polycrystalline Ni Under Tensile Hydrostatic Stress by Molecular Dynamics Simulation

Published:2019-05-01 Issue:5 Volume:19 Page:2723-2731
ISSN:1533-4880
Container-title:Journal of Nanoscience and Nanotechnology
language:en
Short-container-title:j nanosci nanotechnol

Author:

Pei Linqing¹,Lu Cheng¹,Tang Qian²,Zhang Yuanxun²,Li Jiaqing¹,Zhang Che¹,Zhao Xing³,Tieu Kiet¹

Affiliation:

1. School of Mechanical, Materials, Mechatronic and Biomedical Engineering, University of Wollongong, Wollongong, NSW 2522, Australia

2. State Key Laboratory of Mechanical Transmissions, Chongqing University, Chongqing 400044, China

3. State Key Laboratory of High Performance Complex Manufacturing, Central South University, Changsha 410083, China

Publisher

American Scientific Publishers

Subject

Condensed Matter Physics,General Materials Science,Biomedical Engineering,General Chemistry,Bioengineering

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Molecular dynamics simulation of Cr–O–C discrete nuclei to reduce the binding force of nanocrystalline Cu/Ni complexes;Journal of Materials Science;2024-02

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