Intermetallic Growth Mechanism and Mechanical Properties of Post-Annealed SAC305 Solder Joints on Cu-Based Electrode Interfaces-Reference-Cited by-同舟云学术

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Intermetallic Growth Mechanism and Mechanical Properties of Post-Annealed SAC305 Solder Joints on Cu-Based Electrode Interfaces

Published:2019-03-01 Issue:3 Volume:19 Page:1645-1648
ISSN:1533-4880
Container-title:Journal of Nanoscience and Nanotechnology
language:en
Short-container-title:j nanosci nanotechnol

Author:

Beck Jihyun¹,Baek Yeon-Jin²,Son Siyoung¹,Kim Jong-Bae³,Yang Seung-Ho³,Hyun Soong-Keun²

Affiliation:

1. Department of Materials Process Engineering, Inha University, Incheon 22212, Republic of Korea

2. Department of Materials Science and Engineering, Inha University, Incheon 22212, Republic of Korea

3. Heesung Metal LTD., Incheon, 21697, Korea

Publisher

American Scientific Publishers

Subject

Condensed Matter Physics,General Materials Science,Biomedical Engineering,General Chemistry,Bioengineering

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Kinetics of Ni solid-state dissolution in Sn and Sn3.5Ag alloys;Journal of Alloys and Compounds;2019-08

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