Sintering Behavior of Copper Nanoparticle Ink by Laser in Air-Reference-Cited by-同舟云学术

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Sintering Behavior of Copper Nanoparticle Ink by Laser in Air

Published:2019-03-01 Issue:3 Volume:19 Page:1261-1268
ISSN:1533-4880
Container-title:Journal of Nanoscience and Nanotechnology
language:en
Short-container-title:j nanosci nanotechnol

Author:

Yu Jun Ho¹,Jung Hyun Suk²,Jeong Jae Kyeong³,Kang Kyung-Tae¹

Affiliation:

1. Micro/Nano Scale Manufacturing R&D Group, Korea Institute of Industrial Technology, Ansan-si, Gyeonggi-do, 15588, Republic of Korea

2. School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon-si, Gyeonggi-do, 16419, Republic of Korea

3. Department of Electronic Engineering, Hanyang University, Seoul, 04763, Republic of Korea

Publisher

American Scientific Publishers

Subject

Condensed Matter Physics,General Materials Science,Biomedical Engineering,General Chemistry,Bioengineering

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The effect of double scans and elliptical beam during sintering of silver nanoparticle structures via a modulated laser beam;International Journal of Heat and Mass Transfer;2023-10

2. Sintering of silver nanoparticle structures and the pursuit of minimum resistivity;Materials Today Communications;2023-03

3. Additive Manufacturing of 3D Multilayer Devices;Innovative Product Development by Additive Manufacturing 2021;2022-11-13

4. Low-temperature calcination of convenient micro-sized copper ink with surface activation and synchronous protection by in-situ chemisorbed cupric formate;Journal of Materials Science: Materials in Electronics;2022-08

5. Fabrication of wearable strain sensor by using a novel hybrid Cu ink composed of bimodal Cu particle ink and Cu-based metal-organic decomposition ink;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

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