3D Printing Based Single-Build Process for Electronic Devices-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

3D Printing Based Single-Build Process for Electronic Devices

Published:2017-10-01 Issue:10 Volume:17 Page:7259-7263
ISSN:1533-4880
Container-title:Journal of Nanoscience and Nanotechnology
language:en
Short-container-title:j nanosci nanotechnol

Author:

Dang Hyun Woo¹,Kim Young Su²,Yang Young Jin²,Koo Bon Jin¹,Yang Yong Suk¹,You In Kyu¹,Lee Chang Woo³,Doh Yang Hoi⁴,Choi Kyung Hyun²

Affiliation:

1. Electronics and Telecommunications Research Institute, 218, Gajeong-ro, Yuseong-gu, Daejeon 34129, Korea

2. Department of Mechatronics Engineering, Jeju Nat’l Univ., 102, Jejudaehak-ro, Jeju-si, Jeju-do 63243, Korea

3. Korea Institute of Machinery and Materials, 156, Gajeongbuk-ro, Yuseong-gu, Daejeon 34103, Korea

4. Department of Electronic Engineering, Jeju Nat’l Univ., 102, Jejudaehak-ro, Jeju-si, Jeju-do 63243, Korea

Publisher

American Scientific Publishers

Subject

Condensed Matter Physics,General Materials Science,Biomedical Engineering,General Chemistry,Bioengineering

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP