Curing and Dynamic Mechanical Thermal Properties of Epoxy/Clay Nanocomposites-Reference-Cited by-同舟云学术

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Curing and Dynamic Mechanical Thermal Properties of Epoxy/Clay Nanocomposites

Published:2010-04-01 Issue:4 Volume:10 Page:2870-2879
ISSN:1533-4880
Container-title:Journal of Nanoscience and Nanotechnology
language:en
Short-container-title:J. Nanosci. Nanotech.

Author:

Prolongo M. G.,Martínez-Casado F. J.,Masegosa R. M.,Salom C.

Publisher

American Scientific Publishers

Subject

Condensed Matter Physics,General Materials Science,Biomedical Engineering,General Chemistry,Bioengineering

Cited by 21 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Tribological and mechanical analysis of hybrid epoxy based polymer composites with different in situ liquid lubricants (silicone oil, PAO and SN150 base oil);Wear;2022-09

2. Mechanical responses of epoxy/cloisite nanocomposites;Materials Chemistry and Physics;2022-04

3. MoS2: Advanced nanofiller for reinforcing polymer matrix;Physica E: Low-dimensional Systems and Nanostructures;2021-08

4. Nanoclay-modified microcapsules as a latent curing agent in epoxy;Polymer Bulletin;2020-06-17

5. Modification and characterization of an Iranian montmorillonite as a corrosion/mechanical promoter for epoxy coatings;Clay Minerals;2018-11-27

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