Pulse Electrodeposition of Ni-W Alloy for Trench Filling in Microelectromechanical Systems-Reference-Cited by-同舟云学术

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Pulse Electrodeposition of Ni-W Alloy for Trench Filling in Microelectromechanical Systems

Published:2008-10-01 Issue:10 Volume:8 Page:5321-5325
ISSN:1533-4880
Container-title:Journal of Nanoscience and Nanotechnology
language:en
Short-container-title:j nanosci nanotechnol

Author:

Jung Hayong,Hong Chan,Ki Junghee,Kim Jutae,Kim Bonghan,Tak Yongsug

Publisher

American Scientific Publishers

Subject

Condensed Matter Physics,General Materials Science,Biomedical Engineering,General Chemistry,Bioengineering

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Research on Obtaining and Characterizing Ni - W Electroplating Alloys for Micro-Electro Mechanics;BULETINUL INSTITUTULUI POLITEHNIC DIN IAȘI. Secția Matematica. Mecanică Teoretică. Fizică;2022-03-01

2. Ni-W electrodeposited coatings: Characterization, properties and applications;Surface and Coatings Technology;2016-12

3. Microvia Filling with Nickel-Tungsten Alloy to Decrease the Coefficient of Thermal Expansion of Electronic Circuit Interconnections;ECS Electrochemistry Letters;2015-07-01

4. Recent Developments in Supramolecular Approach for Nanocomposites;Journal of Nanoscience and Nanotechnology;2010-01-01

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