Adhesion Improvement of Copper Nanopaste on Glass Surface Modified by Atmospheric-Pressure Plasma
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Published:2016-04-01
Issue:4
Volume:8
Page:303-309
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ISSN:1941-4900
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Container-title:Nanoscience and Nanotechnology Letters
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language:en
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Short-container-title:Nanosci Nanotechnol Lett
Author:
Kim Kwang-Seok,Jung Seung-Boo,Kim Dae UP
Publisher
American Scientific Publishers
Subject
General Materials Science