A Multi-Processing Systems-on-Chip Native Simulation Framework for Power and Thermal-Aware Design-Reference-Cited by-同舟云学术

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A Multi-Processing Systems-on-Chip Native Simulation Framework for Power and Thermal-Aware Design

Published:2011-02-01 Issue:1 Volume:7 Page:2-16
ISSN:1546-1998
Container-title:Journal of Low Power Electronics
language:en
Short-container-title:Journal of Low Power Electronics

Author:

Calvo Daniel,González Pablo,Díaz Luís,Posadas Héctor,Sánchez Pablo,Villar Eugenio,Acquaviva Andrea,Macii Enrico

Publisher

American Scientific Publishers

Subject

Electrical and Electronic Engineering

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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3. PredictNcool;ACM Transactions on Embedded Computing Systems;2019-10-19

4. Source-Level Performance, Energy, Reliability, Power and Thermal (PERPT) Simulation;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2017-02

5. Simulation of Attacks for Security in Wireless Sensor Network;Sensors;2016-11-18

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