Phase-Field Simulation of Interdiffusion and Microstructure of Cu–Ni Diffusion Couples
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Published:2012-09-01
Issue:9
Volume:9
Page:1500-1504
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ISSN:1546-1955
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Container-title:Journal of Computational and Theoretical Nanoscience
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language:en
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Short-container-title:Jnl of Comp & Theo Nano
Author:
Li Yongsheng,Cheng Xiaoling,Xu Feng,Du Yulei,Chen Guang
Publisher
American Scientific Publishers
Subject
Electrical and Electronic Engineering,Computational Mathematics,Condensed Matter Physics,General Materials Science,General Chemistry