A Novel Method of Electrical Measurement for Stacking Error in 3D/2.5D Integration
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Published:2018-02-01
Issue:2
Volume:18
Page:1066-1069
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ISSN:1533-4880
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Container-title:Journal of Nanoscience and Nanotechnology
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language:en
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Short-container-title:j nanosci nanotechnol
Author:
Lee Shih-Wei1,
Kuo Shu-Chiao1,
Chen Kuan-Neng1
Affiliation:
1. Department of Electronics Engineering, National Chiao Tung University, Hsinchu 300, Taiwan
Publisher
American Scientific Publishers
Subject
Condensed Matter Physics,General Materials Science,Biomedical Engineering,General Chemistry,Bioengineering