Asymmetric Low Temperature Bonding Structure with Thin Solder Layers Using Ultra-Thin Buffer Layer
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Published:2018-08-01
Issue:8
Volume:18
Page:5397-5403
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ISSN:1533-4880
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Container-title:Journal of Nanoscience and Nanotechnology
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language:en
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Short-container-title:j nanosci nanotechnol
Author:
Yu Ting-Yang1,
Liang Hao-Wen1,
Chang Yao-Jen1,
Chen Kuan-Neng1
Affiliation:
1. Department of Electronics Engineering, National Chiao Tung University, Hsinchu 300, Taiwan
Publisher
American Scientific Publishers
Subject
Condensed Matter Physics,General Materials Science,Biomedical Engineering,General Chemistry,Bioengineering