Polymer-Metal Composite Thin Film Microcap Packaging Technology Using Low Temperature SU-8 Bonding-Reference-Cited by-同舟云学术

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Polymer-Metal Composite Thin Film Microcap Packaging Technology Using Low Temperature SU-8 Bonding

Published:2016-11-01 Issue:11 Volume:16 Page:11613-11618
ISSN:1533-4880
Container-title:Journal of Nanoscience and Nanotechnology
language:en
Short-container-title:j nanosci nanotechnol

Author:

Choi Jinnil¹,Kim Yong-Kook²,Kim Soo-Won²,Nam Byung Hyun¹,Ju Byeong-Kwon³

Affiliation:

1. Department of Mechanical Engineering, Hanbat National University, Daejeon 305-719, Republic of Korea

2. Department of Electronics and Computer Engineering, Korea University, Seoul 136-713, Republic of Korea

3. Display and Nanosystem Laboratory, College of Engineering, Korea University, Seoul 136-713, Republic of Korea

Publisher

American Scientific Publishers

Subject

Condensed Matter Physics,General Materials Science,Biomedical Engineering,General Chemistry,Bioengineering

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Microcap (or Microstructure) Transfer Techniques;Springer Series in Advanced Manufacturing;2018

2. Effect of Surface Activated Bonding on Adhesion Strength Between Al and Al2O3;Nanoscience and Nanotechnology Letters;2017-08-01

3. Evaluation of the Long-Term Reliability of the Epoxy-Contained SAC305 Solder with Organic Solderability Preservative Surface Finish;Nanoscience and Nanotechnology Letters;2017-08-01

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