The Stress Induced by the Epoxy Bonding Layer Changing in the Layered Hollow Spheres

Abstract

In order to solve the problem of the instability of the layered hollow spherical structure caused by the epoxy bonding layer cracking, peeling and destruction, an exact analytical solution of the multi-layered hollow sphere with epoxy bonding layer under point load is obtained. The influence of the epoxy bonding layer change on the stress of the layered hollow sphere is studied by using the methods of analytical solution and numerical calculation. Numerical calculation results show that the stress of the bonded layered structure is affected by the Young’s modulus, Poisson’s ratio and the thickness of the bonding material without changing the overall size of the bonded layered hollow spheres. The use of the bonding materials can cause stress concentration at the bonding material interface. And the increase of Young’s modulus and the thinning of thickness of the bonding material can reduce the stress at the interface between the epoxy bonding layer and the outer layer. Moreover, the change of Poisson’s ratio of the bonding material cannot substantially reduce the interface stress. The research results provide theoretical guidance for the material selection and thickness setting of the bonding layer for layered hollow sphere.