Simulation of Thermomechanical Closure of an Initially Open Interface Crack with Heat Resistance-Reference-Cited by-同舟云学术

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Simulation of Thermomechanical Closure of an Initially Open Interface Crack with Heat Resistance

Published:2003-09 Issue:5 Volume:39 Page:672-681
ISSN:1068-820X
Container-title:Materials Science
language:en
Short-container-title:Materials Science

Author:

Martynyak R. M.,Honchar Kh. I.,Nahalka S. P.

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Cited by 15 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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