Molecular Dynamics simulations of Cu/Ta and Ta/Cu thin film growth-Reference-Cited by-同舟云学术

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Molecular Dynamics simulations of Cu/Ta and Ta/Cu thin film growth

Published:2003 Issue:2 Volume:10 Page:61-74
ISSN:0928-1045
Container-title:Journal of Computer-Aided Materials Design
language:en
Short-container-title:Journal of Computer-Aided Materials Design

Author:

Klaver T.P.C.,Thijsse B.J.

Publisher

Springer Science and Business Media LLC

Subject

Computational Theory and Mathematics,Computer Science Applications,General Materials Science

Cited by 20 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Evaluation of Cu surface diffusion on different metal liner materials for Cu reflow applications;Journal of Materials Research;2024-09-09

2. Design of Ta gradient layer to improve adhesion strength between Cu substrate and DLC film;Vacuum;2022-09

3. Molecular Dynamics Study on Mechanical Properties of Nanocrystalline tantalum;2019 IEEE 19th International Conference on Nanotechnology (IEEE-NANO);2019-07

4. Nanoscale Cu/Ta multilayer deposition by co-sputtering on a rotating substrate. Empirical model and experiment;Surface and Coatings Technology;2016-09

5. Molecular dynamics in the examination of the atomic structure of small-sized metallic objects;Inorganic Materials;2015-11-13

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