Micromechanisms and Mechanics of Damage and Fracture in Thin Film/Substrate Systems-Reference-Cited by-同舟云学术

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Micromechanisms and Mechanics of Damage and Fracture in Thin Film/Substrate Systems

Published:2004-02 Issue:2 Volume:40 Page:140-155
ISSN:1063-7095
Container-title:International Applied Mechanics
language:en
Short-container-title:International Applied Mechanics

Author:

Mishnaevsky L. L.,Gross, Jr. D.

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A variational approach to the fracture of brittle thin films subject to out-of-plane loading;Journal of the Mechanics and Physics of Solids;2013-11

2. The Use of the Cavitation Effect in the Mitigation;Strojniški vestnik – Journal of Mechanical Engineering;2013-04-15

3. Effect of substrate and film thickness on the growth, structure, mechanical and optical properties of chromium diboride thin films;Surface and Coatings Technology;2012-09

4. Deposition of Amorphous CNx Materials in BrCN Plasmas: Exploring Adhesion Behavior as an Indicator of Film Properties;ACS Applied Materials & Interfaces;2011-03-29

5. Direct stress measurements in thin polymer films;Soft Matter;2011

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