Author:
Euh Jeongseon,Chittamuru Jeevan,Burleson Wayne
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Information Systems,Signal Processing
Cited by
2 articles.
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1. A Fast Compression Framework Based on 3D Point Cloud Data for Telepresence;International Journal of Automation and Computing;2020-07-31
2. EA-GLES: An Energy-Aware 3D Graphics Library for Mobile Devices;2017 IEEE International Conference on AI & Mobile Services (AIMS);2017-06