10.1023/A:1015776820115
Author:
Publisher
Springer Science and Business Media LLC
Subject
General Materials Science
Cited by 28 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
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5. Constitutive Models for Intermediate- and High-Strain Rate Flow Behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu Solder Alloys;IEEE Transactions on Components, Packaging and Manufacturing Technology;2013-01
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