Bi-philic Copper Surface Pool Boiling Heat Transfer Performance as a Function of Electrochemical Deposition Time
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Published:2023-12-31
Issue:12
Volume:47
Page:623-629
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ISSN:1226-4881
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Container-title:Transactions of the Korean Society of Mechanical Engineers - B
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language:en
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Short-container-title:KSME-B
Author:
Kim Gyuchang,Kim Mingwan,Lee Jaeseon
Publisher
The Korean Society of Mechanical Engineers
Subject
Mechanical Engineering