Tensile Tests for Copper Thin Foils by Using DIC Method
Author:
Publisher
The Korean Society of Mechanical Engineers
Subject
Mechanical Engineering
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Proper Orthogonal Decomposition-Deep-Learning-based Prediction of Plastic Properties Using Indentation Surface Displacement;Transactions of the Korean Society of Mechanical Engineers - A;2022-01-31
2. Analysis of Tensile Testing Errors in Metal Thin Film Using the DIC Method;Transactions of the Korean Society of Mechanical Engineers - A;2020-07-31
3. Effect of the Deformation State on the Mechanical Degradation of Cu Metal Films on Flexible PI Substrates During Cyclic Sliding Testing;Metals and Materials International;2018-06-14
4. Tension Tests of Copper Thin Films;T KOREAN SOC MEC ENG;2017
5. Analysis of Deformation and Failure Behaviors of TIG Welded Dissimilar Metal Joints Using Miniature Tensile Specimens;Korean Journal of Metals and Materials;2017-02-05
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