Solder Bump Deposition Using a Laser Beam
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Published:2012-01-01
Issue:1
Volume:36
Page:37-42
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ISSN:1226-4873
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Container-title:Transactions of the Korean Society of Mechanical Engineers A
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language:en
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Short-container-title:Transactions of the Korean Society of Mechanical Engineers A
Author:
Choi Won-Suk,Kim Jea-Woon,Kim Jong-Hyeong,Kim Joo-Han
Publisher
The Korean Society of Mechanical Engineers
Subject
Mechanical Engineering