Controlling Void Contents in the Zn Interlayer for Improving Adhesion Strength of ZnMg/Zn Bilayer Coatings on TRIP Steel
Author:
Affiliation:
1. Semiconductor Processing Development, Semiconductor R&D Center, Samsung, Hwaseong
2. Heat and Surface Technology R&D Department, Korea Institute of Industrial Technology (KITECH)
3. Department of Materials Engineering, Korea Aerospace University
Publisher
Iron and Steel Institute of Japan
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Link
https://www.jstage.jst.go.jp/article/isijinternational/63/10/63_ISIJINT-2023-186/_pdf
Reference30 articles.
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3. 3) J. La, S. Lee and S. Hong: Surf. Coat. Technol., 259 (2014), 56. https://doi.org/10.1016/j.surfcoat.2014.07.006
4. 4) K. Bae, J. La, I. Lee, S. Lee and K. Nam: Met. Mater. Int., 23 (2017), 481. https://doi.org/10.1007/s12540-017-6478-2
5. 5) O. P. Femminella, M. J. Starink, M. Brown, I. Sinclair, C. J. Harris and P. A. S. Reed: ISIJ Int., 39 (1999), 1027. https://doi.org/10.2355/isijinternational.39.1027
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