Production of selective membranes using plasma deposited nanochanneled thin films
Author:
Affiliation:
1. Universidade de São Paulo, Brazil
2. Universidade de São Paulo, Brazil; Faculdade de Tecnologia de São Paulo, Brazil
Publisher
FapUNIFESP (SciELO)
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
http://www.scielo.br/pdf/mr/v9n4/06.pdf
Reference13 articles.
1. Effect of substrate on the step coverage of plasma-enhanced chemical-vapor deposited tetraethylorthosilicate films;Lan JK;Journal of Vacuum Science & Technology B,2003
2. Plasma polymerization of tetraethoxysilane on aluminum granules for corrosion protection;Iriyama Y;Thin Solid Films,1996
3. Cyclic plasma deposition of SiO2 films at low temperature (80 °C) with intermediate plasma treatment;Yi C;Journal of Vacuum Science & Technology A - Vacuum Surfaces and Films,2002
4. Origin of low dielectric constant of carbon-incorporated silicon oxide film deposited by plasma enhanced chemical vapor deposition;Kim JY;Journal of Applied Physics,2001
5. Effects of annealing on the properties of Cu/low k polymer/Si structures prepared by plasma polymerization of decahydronaphthalene and tetraethylorthosilicate and Cu sputtering;Shim C;Thin Solid Films,2002
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