The Effect of the Cooling Rate on the Microstructure and Microsegregation: An Experimental and Numerical Investigation of Solidification in Hypoperitectic Cu − 20 wt.% Sn Alloy
Author:
Affiliation:
1. Universidade Federal Fluminense, Brasil
2. Universidade Federal Fluminense, Brasil; Instituto Federal do Rio de Janeiro, Brasil
Publisher
FapUNIFESP (SciELO)
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
http://www.scielo.br/pdf/mr/v23n4/1516-1439-mr-23-4-e20200110.pdf
Reference37 articles.
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3. Microstructural evolution during upward and downward transient directional solidification of hypomonotectic and monotectic Al-bi alloys;Silva AP;J Alloys Compd,2009
4. The effect of the growth rate on microsegregation: experimental investigation in hypoeutectic Al–Fe and Al–Cu alloys directionally solidified;Meza ES;J Alloys Compd,2013
5. Effect of solidification processing parameters and silicon content on the dendritic spacing and hardness in hypoeutectic Al-Si alloys;Sales RC;Mater Res,2018
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2. Investigations on metallurgical parameters in hypoeutectic Al–Si alloys under upward directional solidifications;The International Journal of Advanced Manufacturing Technology;2022-07-29
3. Simultaneously enhanced strength and ductility of Cu-15Ni-8Sn alloy with periodic heterogeneous microstructures fabricated by laser powder bed fusion;Additive Manufacturing;2022-06
4. Microstructural Patterns, Microsegregation, Porosity, and Mechanical Properties of Hypoeutectic Al-Fe Alloy, and its Dependency with Solidification Thermal Parameters;Materials Research;2022
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