New Developments in the Dynamic Mechanical Analysis of Thin-Layer Materials

Abstract

AbstractThe vibrating-membrane configuration represents an important new approach to the dynamic mechanical analysis of thin-layer materials. The method offers a convenient capability for high-resolution stress measurements over a wide temperature range, and can be combined if desired with internal friction measurements for the detection of defect-related relaxation peaks. Illustrative results are given for the thermomechanical behavior of silicon, silicon carbide, and synthetic diamond membranes, and for the moisture swelling of polyimide films. A detailed study of hydrogen-boron point defects in silicon is in progress, using both internal stress and internal friction measurements, and work on membranes has been supplemented significantly by the use of vibrating-string and ultra-thin vibrating-reed samples.