Author:
Mitomo Mamoru,Kim Young-Wook,Hirotsuru Hideki
Abstract
Ultrafine silicon carbide powder with an average particle size of 90 nm was densified by hot-processing with the addition of Al2O3, Y2O3, and CaO at 1750 °C. Silicon carbide nanoceramics with an average grain size of 110 nm were prepared by liquid phase sintering at low temperature. The materials showed superplastic deformation at a strain rate of 5.0 × 10-4/s at 1700 °C, which is the lowest temperature published. The microstructure and deformation behavior of materials from a submicrometer powder were also investigated as a reference.
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Cited by
103 articles.
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