Stress-induced formation of structural defects on the {311} planes of silicon

Author:

Weng-Sieh Z.,Krulevitch P.,Gronsky R.,Johnson G.C.

Abstract

Structural defects occurring on the {311} planes of single crystal silicon have been observed near the bottom oxide corner in silicon-on-insulator structures formed by selective epitaxial growth. These {311} defects exhibit a preferential orientation and are clustered near the silicon/silicon dioxide interface. This new observation provides an opportunity to study the mechanism of {311} defect generation in a system with discernible microstructure and stress state. High resolution electron microscopy combined with analytical and numerical three-dimensional stress modeling are used to show the dependence of these {311} defects on the local stress field, and to establish their origin in terms of a homogeneous dislocation nucleation model.

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Stress-induced oxygen precipitation in CzSi;Materials Science and Engineering: B;1996-01

2. Stress-induced oxygen precipitation in Cz-Si;C,H,N and O in Si and Characterization and Simulation of Materials and Processes;1996

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