Author:
Comita Paul B.,Larson Carl E.
Abstract
AbstractNew materials have been developed for the repair of electrical open defects in AMLICD panel circuitry The metal-containing precursors are volatile, easily pyrolyzed to high purity conducting metal, and are decomposed at temperatures which will not damage the glass substrate or thin film circuitry. New materials have been developed for additive metal repair as well as additive passivation repair. The repair or data line metallurgy on prototype arrays has been achieved, resulting in electrical resistances of the repaired interconnects which were comparable to those of unrepaired interconnects of identical geometry.
Publisher
Springer Science and Business Media LLC
Cited by
1 articles.
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