Author:
Akbulut Mustafa B.,Silva Helena,Gokirmak Ali
Abstract
ABSTRACTAccumulated body [1] approach to mitigate the effects of line edge roughness on bulk silicon finFETs and tri-gate FETs is analyzed through 3D TCAD simulations. A side-gate surrounding the body portion of the FET is used to accumulate the body with majority carriers. This approach is predicted to reduce device-to-device variability due to line edge roughness by stronger accumulation of the body in the wider sections of the channel and confinement of the channel away from the edges.
Publisher
Springer Science and Business Media LLC