Author:
Townsend P. H.,Huber B. S.,Wang D. S.
Abstract
ABSTRACTWafer bending measurements have been used to study the glass transition temperature, Tg, of thin coatings of polystyrene and polycarbonate on Si wafers. The observed values of Tg agree with DSC and TMA measurements on bulk samples. The evolution of the substrate curvature has been used to examine the behavior of Tg in thin epoxy films and coatings derived from divinylsiloxane bisbenzocyclobutene, mixed stereo and positional isomers of 1, 3-bis(2-bicyclo[4.2.0]octa-1, 3, 5-trien-3-ylethenyl)-1, 1, 3, 3-tetramethyl disitoxane (CAS 117732–87–3). The dependence of the Tg of the epoxide coatings is studied as a function of the cross-linking. The evolution of the Tg in the benzocyclobutene coating is found to be a monotonie function of the level of conversion of the polymer network.
Publisher
Springer Science and Business Media LLC
Reference8 articles.
1. Film Stress in High Density Thin Film Interconnect
2. 5. ASTM Annual Book of Standards 1988, Vol. 08.03, Designation D 3418 – 82, page 90.
3. 8. Stokich T. M. Jr , Proceedings of the Materials Research Society, Symposium on Materials Science of High Temperature Polymers for Microelectronics, Los Angeles (1991).
4. Benzocyclobutene (BCB) dielectrics for the fabrication of high density, thin film multichip modules
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