Author:
Singh R.,Parihar V.,Chen Y.,Poole K. F.,DeBoer S.,Thakur R. P. S.,Sharangpani R.,Vasudev P. K.
Abstract
ABSTRACTIn recent years, we have developed rapid photothermal chemical vapor deposition (RPCVD) technique. In RPCVD, photons with wavelength between 100–400 nm irradiate the side of the substrate where chemical reactions take place. RPCVD provides materials with minimum microscopic defects and minimum thermal and residual stress. Due to these features and low processing time and low processing temperature capabilities, RPCVD is ideal for process integration and manufacturibility. In this paper we have presented the results of high K and low K dielectrics. Detailed electrical, structural, characterization, and stress measurements combined with reliability of data indicate that RPCVD has the potential of meeting advanced manufacturing needs of semiconductor and other related industries.
Publisher
Springer Science and Business Media LLC