Abstract
A model for the growth of a grain boundary crack in thermomechanical fatigue is derived for a single-phase or low alloy fcc metal at homologous temperatures near 0.5. Crack growth is hypothesized to proceed through vacancies binding in pairs at the crack tip to impurities or an oxide layer. This model is applied to 97Pb−3Sn, and the results compared with experiment. Good agreement is shown between the model and experiment, especially in predicting the effects of frequency and thermal-mechanical phasing. These effects do not appear to have been previously modeled successfully.
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference58 articles.
1. Grain boundary activity measurements by auger electron spectroscopy
2. Desorption Process by Grain Boundary Diffusion in Thin Plate
3. 26 Lawson L. , “Computational Aspects of a Model of Thermo-mechanical Fatigue in a Lead-Base Alloy”, AIP document no. PAPS JMREEE-8-745-108 for 108 pages of supplementary material. Order prepaid by PAPS number and journal reference from the American Institute of Physics Auxiliary Publication Service, 335 East 45th Street, New York, NY 10017.
4. The effect of atmosphere on the fatigue of lead
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