Abstract
AbstractCopper films with a small amount of an alloy element (1 wt % Ti) were metallized on polyimide. Plasma pre-treatment of the polyimide surface and post-metallization annealing were used to modify the interface. Interfaces and metal film layers were investigated; a drastic increase in adhesion strength, the suppression of Cu diffusion into polyimide, and the improvement of (111) texture were found. Composition analysis data taken from the interface indicated the accretion of nitrogen at the interface. The formation of Ti-related chemical bonds, suggested by X-ray photoelectron spectroscopy, can explain the above-mentioned experimental results.
Publisher
Springer Science and Business Media LLC
Cited by
2 articles.
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1. The facile surface modification of poly(p-xylylene) ultrathin films;Colloids and Surfaces A: Physicochemical and Engineering Aspects;2003-04
2. Aqueous ammonium sulfide to modify the surface of low κ dielectric thin films;Colloids and Surfaces A: Physicochemical and Engineering Aspects;2003-03